The main difference between TSSOP and SSOP is the width of the pads or pins, the pitch between the two remains . 65 mm the width of the pads varies from .
What is the difference between SOIC and TSSOP?
The SOIC is taller (1.75mm vs. 1.2mm) which is enough to make a difference in a thin product. The lead pitch is much closer (almost half) on the TSSOP- 0.65mm vs. 1.27mm, so for crude manufacturing processes the SOIC might well be preferred.
What does TSSOP stand for?
Thin-shrink small outline package (TSSOP)
What is Ssop IC?
Shrink small-outline package (SSOP) chips have “gull wing” leads protruding from the two long sides, and a lead spacing of 0.0256 inches (0.65 mm) or 0.025 inches (0.635 mm). This yields an IC package with a significant reduction in the size compared to standard package.
What is the difference between SOP and SSOP?
By definition, an SOP is a set of written instructions that document a food manufacturer’s routine or repetitive activity. For all sanitation-related processes, jobs or activities, the term SSOP (Sanitation SOP) is reserved.
What is SOIC packaging?
The SOIC is a surface mount integrated circuit package. The standard form is a flat rectangular body, with leads extending from two sides. The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB. The pad can be soldered to the PCB to dissipate heat.
What are different types of IC packaging?
The Common IC Packaging Types
- DIP (Double In-line Package)
- SOP/SOIC/SO (Small Outline Package)
- QFP (Quad Flat Package)
- QFN/LCC (Quad Flat Non-leaded Package)
- BGA (Ball Grid Array Package)
- CSP (Chip Scale Package)
What is GMP and SSOP?
The basis of the food-safety system to be adopted in the food industry consists of a combination of good manufacturing practices (GMP), sanitation standard operating procedures (SSOP), and a hazard analysis and critical control point (HACCP) system.
What is SSOP and why is it important?
SSOP are written procedures developed and implemented in a facility to prevent direct contamination or adulteration of the products. The facility is required to maintain these written procedures on file, and these must be available to regulating or government bodies upon request.
What is SOT package?
Small Outline Transistor (SOT) packages are very small, inexpensive surface-mount plastic-molded packages with leads on their two long sides. Due to their low cost and low profile, SOT’s are widely used in consumer electronics. The SOT-23 and the SC-70 packages are two of the most widely used SOT packages today.
What is a Wson package?
WSON. Very-very-thin small-outline no-lead package. USON. Very-very-thin small-outline no-lead package.
What is the difference between TSSOP and shrink Small OutliNe package?
SSOP package having leads in two side of periphery and having lead pitch less than 1.0mm, said package named Shrink Small Outline Package. TSSOP package having an encapsulant width less than 300mils covering entire package, having total height less than 1.2mm, said package named Thin Shrink Small Outline Package.
What is the difference between the TSSOP and the SOIC?
The SOIC is more than 50% longer than the TSSOP. (4.9mm vs. 3.0mm) and only a bit wider. That may not seem like a lot to you, but on a crowded board it might make a difference. The SOIC is taller (1.75mm vs. 1.2mm) which is enough to make a difference in a thin product.
What is the difference between dip and so and SSOP?
The SO has the same pin as the corresponding DIP package. It reduces space by approximately 30 to 50% compared to the equivalent DIP package and reduces thickness by approximately 70%. SSOP package having leads in two side of periphery and having lead pitch less than 1.0mm, said package named Shrink Small Outline Package.
Will a TSSOP part fit in a SSOP footprint?
Odds are a TSSOP part will fit a SSOP footprint. You need to be cautious the other way around. overall its likely that either way they will fit the footprint. When you by SSOP/TSSOP dev boards they usually use one footprint that will accommodate both types. I just experienced the difference with my last design.
